In accordance with a report from DigiTimes, Intel is working to safe a piece of TSMC’s N3 (3nm) provide for its next-to-next-gen Arc “Celestial/Druid” graphics playing cards. Presently, the 2 foundry rivals are working collectively on the Arc “Alchemist” graphics playing cards set to launch within the first half of 2022. Alchemist will likely be fabbed on the N6 node which is basically the N7 node with improved libraries. Along with Alchemist, among the chiplets/tiles of the Ponte Vecchio HPC accelerator can even be fabbed by TSMC on its 5nm EUV course of node.
TSMC plans to begin mass manufacturing of its 3nm node within the second half of 2022 which signifies that the primary prospects (learn: Apple) will likely be getting the primary shipments of those wafers in late 2022/early 2023. AMD, NVIDIA, Qualcomm, MediaTek, and Intel will more than likely have to attend it out until late 2023. In accordance with trade sources, Intel executives will meet with their Taiwanese counterparts in December and finalize the finer particulars, such because the capability, supply, and different specifics.
The primary wave of 3nm shipments will likely be restricted to underneath 60,000 items per thirty days, with the second wave rising it to roughly 100K by the primary half of 2023. It’s unlikely that Intel will be capable to get a share of the previous, and can most likely must accept the latter, alongside AMD, NVIDIA, and Qualcomm. It’s unclear simply how the availability chain will likely be affected by the addition of one other main chipmaker as a shopper of TMSC’s most superior node, however I reckon stock will likely be stretched skinny.
Along with this, Intel can be anticipated to conduct preliminary negotiations to guide a portion of TSMC’s 2nm course of capability. Intel is planning to carry its FMO (Fab Supplies Group) Digital Provider Summit on 14th and fifteenth December. That is when the chipmaker is anticipated to finalize the cope with TSMC which has already confirmed its participation within the summit.